June 2020
EMMC CID: 90014A
EMMC CSD: D0270
EMMC NAME: hB8aP> , Vendor: SKHYNIX , S/N: 3D1412E2 , rev. 01
EMMC NAME (HEX):
EMMC ROM 1 (Main User Data) Capacity: (000747C00000)
EMMC ROM 2/3 (Boot Partition 1/2) Capacity: (000000400000)
EMMC RPMB (Replay Protected Memory Block) Capacity: (000001000000)
Extended CSD rev: 1.8 (MMC 5.1)
Boot from: ROM1 (Main User Area) , width: 1 bit
Boot Partition [179] / Bus Config [177] : 0x38 / 0x00
H/W Reset Function [162] : 0x01 , RST_n signal is permanently enabled
Partition setting [PARTITION_SETTING_COMPLETE] : 0x00
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RP64MB (0x525036344d42), rev: 0x01, serial number: 0x5C02E47F
Manufacturing date: Jul 2019
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
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